About us

SEMIgear is an established leader in the design, development and manufacturing of fluxless reflow equipment for the semiconductor packaging industry since 2002.

The company was acquired in 2012 by PSK Holdings, a company which leads semiconductor packaging industry worldwide. SEMIgear and PSK Holdings work closely together to provide equipments and services for fluxless reflow technology.

Product

SEMIgear's fluxless reflow equipment, GENEVA, holds high performance, low CoO, compact footprint and eco-friendly process, and quickly replacing former flux reflow equipment. With No.1 worldwide marketshare, GENEVA is one of a kind with field proven stability and quality. It offers a solution to meet customer need such as warpage minimization ,FOWLP, and high quality product. GENEVA is under development to apply at bonding reflow process as well as fluxless reflow process.

GENEVA xp

  • Low CoO & high reliability
  • Small footprint
  • Warpage minimization
  • High productivity
  • High throughput & yield

VIENNA

  • Low CoO
  • Small footprint with 550mm panel size
  • Warpage minimization
  • Great temperature uniformity
  • High throughput & yield

Technology

GENEVA, SEMIgear‘s fluxless reflow equipment, holds high performance, low CoO, compact footprint and eco-friendly process. It is quickly replacing former flux reflow equipment. With No.1 worldwide marketshare, GENEVA is one of a kind with field proven stability and quality. It offers a solution to meet customer needs such as warpage minimization, FOWLP, and high quality product. GENEVA is under development to apply at bonding reflow process.

The advantage of fluxless reflow process over flux reflow process

Low cost of ownership

  • Eliminates the step of dispensing and cleaning, leading to higher throughput
  • Lower cost of ownership from fewer steps

High reliability

  • Capable of small pitches
  • Prevents Sn overflow on Cu sidewall, common in flux process
  • Eliminates flux-borne polymer damage
Warpage solution

Ring clamp

  • Design to hold the edge of wafer
  • Improves temperature uniformity on wafer

Multi vaccum chuck

  • Individual vaccum control at center, middle and edge
  • Cap can be easily modified without change of chuck

Dual zone top heater

  • Individual temp control at center and edge

Global networks